What provides a metallic path between an affected structure and the source of stray current?

Mitigation bonds are used to address the problem of stray currents in environments where corrosion is a concern. These bonds create a metallic connection between a structure and a grounding point, often designed to divert stray currents away from sensitive areas or to safely dissipate them. Stray currents can lead to corrosion on structures, particularly those buried or submerged in electrolytic environments. By installing mitigation bonds, you effectively create a low-resistance path for stray currents to follow, reducing their impact on the structure and preventing damage.

Other terms like telluric bonds, dynamic bonds, and electrolyte bonds do not specifically refer to the method of providing a metallic path for managing stray currents in this context. Thus, the concept of mitigation bonds is crucial for establishing an effective strategy to protect structures from the adverse effects of stray currents.